mpxhz6130a rev 0, 07/2006 freescale semiconductor technical data ? freescale semiconductor, in c., 2006. all rights reserved. media resistant and high temperature accuracy integrated silicon pressure sensor for measuring absolute pressure, on-chip signal conditioned, temperature compensated and calibrated the mpxhz6130a series sensor integrat es on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. the sensor's packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. the small form factor and high reliability of on-chip integration make the freescale semiconductor, inc. pressure sensor a logical and economical choice for the system designer. the mpxhz6130a series piezoresistive transducer is a state-of-the-art, monolithic, signal conditio ned, silicon pressure sensor. this sensor combines advanced micromachining techniques, th in film metallization, and bipolar semiconductor processing to provide an accu rate, high level analog output signal that is proportional to applied pressure. figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. features ? resistant to high humidity and common automotive media ? improved accuracy at high temperature ? 1.5% maximum error over 0 to 85 c ? ideally suited for mi croprocessor or microcontroller-based systems ? temperature compensated from -40 to +125 c ? durable thermoplastic ( pps) surface mount package typical applications ? aviation altimeters ? industrial controls ? engine control/manifold absolute pressure (map) ? weather station and weather reporting devices ordering information device type options case no. mpx series order no. packing options device marking super small outline package basic element absolute, element only 1317 mpxhz6130a6u rails mpxhz6130a absolute, element only 1317 mpxhz6130a6t1 tape & reel mpxhz6130a ported element absolute, axial port 1317a mpxhz6130ac6u rails mpxhz6130a absolute, axial port 1317a MPXHZ6130AC6T1 tape & reel mpxhz6130a mpxhz6130a series integrated pressure sensor 15 to 130 kpa (2.2 to 18.9 psi) 0.2 to 4.8 v output mpxhz6130a6u case 1317-04 mpxhz61630ac6u case 1317a-03 super small outline package super small outline package pin numbers (1) 1. pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is denoted by the notch in the lead. 1 n/c 5 n/c 2 v s 6 n/c 3 gnd 7 n/c 4 v out 8 n/c
mpxhz6130a sensors 2 freescale semiconductor figure 1. fully integrated pressure sensor schematic table 1. maximum ratings (1) 1. exposure beyond the specified limits may cause permanent damage or degradation to the device. rating symbol value units maximum pressure (p1 > p2) p max 400 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c output source current @ full scale output (2) 2. maximum output current is cont rolled by effective impedance from v out to gnd or v out to v s in the application circuit. i o +0.5madc output sink current @ minimum pressure offset (2) i o --0.5madc pins 1, 5, 6, 7, and 8 are no connects sensing element v out v s gain stage #2 gnd and ground reference shift circuitry thin film temperature compensation and gain stage #1
mpxhz6130a sensors freescale semiconductor 3 table 2. operating characteristics (v s = 5.0 vdc, t a = 25 c unless otherwise noted, p1 > p2) characteristic symbol min typ max unit pressure range p op 15 ? 130 kpa supply voltage (1) 1. device is ratiometric within this specified excitation range. v s 4.75 5.0 5.25 vdc supply current i o ?6.010madc minimum pressure offset (2) (0 to 85 c) @ v s = 5.0 volts 2. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off 0.132 0.200 0.268 vdc full scale output (3) (0 to 85 c) @ v s = 5.0 volts 3. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. v fso 4.632 4.700 4.768 vdc full scale span (4) (0 to 85 c) @ v s = 5.0 volts 4. full scale span (v fss ) is defined as the algebraic difference between the output volt age at full rated pressure and the output voltage at the minimum rated pressure. v fss 4.365 4.500 4.635 vdc accuracy (5) (0 to 85 c) 5. accuracy is the deviation in actual output from nominal output over the entire pr essure range and temperature range as a perc ent of span at 25 c due to all sources of error including the following: ? linearity: output deviation from a straight line relations hip with pressure over t he specified pressure range. ? temperature hysteresis: output deviation at any temperature with in the operating temperature range, after the temperature is cy cled to and from the minimum or maximum operating temperatur e points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cy cled to and from mini mum or maximum rated pressure at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum pressu re applied, over the temperature range of 0 to 85 c, relative to 25 c. ??? 1.5 %v fss sensitivity v/p ? 39.2 ? mv/kpa response time (6) 6. response time is defined as the time fo r the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?ms warm-up time (7) 7. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. ??20?ms offset stability (8) 8. offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. ?? 0.25 ? %v fss
mpxhz6130a sensors 4 freescale semiconductor figure 2. cross sectional di agram sop (not to scale) . figure 3. typical application circuit (output source current operation) figure 4. output versus absolute pressure figure 4 shows the sensor output signal relative to pressure input. typical minimum and maximum output curves are shown for operation over 0 to 85 c temperature range. the output will saturate outside of the rated pressure range. a gel die coat isolates the di e surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor di aphragm. the gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. contact the factory for more information regarding media compatibility in your specific application. wire bond stainless steel cap thermoplastic case die bond sealed vacuum reference fluoro silicone gel die coat lead frame absolute element p1 die v s pin 2 +5.0 v gnd pin 3 v out pin 4 mpxhz6130a to adc 100 nf 51 k 47 pf output (volts) 5.0 4.5 4.0 3.5 3.0 pressure (ref: to sealed vacuum) in kpa max min 10 20 30 40 50 60 70 80 90 100 2.5 2.0 1.5 1.0 0.5 0 110 transfer function: v out =vs x (0.007826 xp(kpa) - 0.07739) +/- (pe x tm x vs x 0.007826) pe = +/- 1.725kpa tm = 1 @ 0 to 85c vs = 5.0vdc 120 typ 130 140
mpxhz6130a sensors freescale semiconductor 5 nominal transfer value: v out = v s x (0.007826 x p(kpa) - 0.07739) (pressure error x temp. factor x 0.007826 x v s ) v s = 5.0 0.25 vdc transfer function (mpxhz6130a) temperature error band mpxhz6130a series break points temp multiplier - 40 3 0 to 85 1 125 1.75 temperature in co 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 140 120 100 80 temperature error factor note: the temperature multiplier is a linear re sponse from 0oc to -40oc and from 85oc to 125oc pressure error band error limits for pressure 3.0 2.0 1.0 -1.0 -2.0 -3.0 0.0 20 pressure (in kpa) pressure error (kpa) 15 to 130 (kpa) 1.725 (kpa) 40 60 80 100 120 pressure error (max)
mpxhz6130a sensors 6 freescale semiconductor minimum recommended footprint for super small packages surface mount board la yout is a critical portion of the total design. the footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self-align when subjected to a solder reflow process. it is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. figure 5. ssop footprint (case 1317 and 1317a) package dimensions 0.027 typ 8x 0.69 0.053 typ 8x 1.35 inch mm 0.387 9.83 0.150 3.81 0.050 1.27 typ case 1317-04 issue f super small outline package
mpxhz6130a sensors freescale semiconductor 7 package dimensions case 1317a-03 issue c super small outline package
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